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E6E12

CIRCUIT COMPONENTS · Semiconductor materials and packages for RF use

E6E12E6E →

Why are DIP through-hole package ICs not typically used at UHF and higher frequencies?

  1. AExcessive dielectric loss
  2. BEpoxy coating is conductive above 300 MHz
  3. CExcessive lead length
  4. DUnsuitable for combining analog and digital signals
Why A dual inline package has relatively long leads running from the chip die out through the plastic body and down to the board. At UHF those leads act as series inductors and small antennas, adding parasitic reactance, unwanted coupling and resonances that ruin the circuit's intended behavior. Surface-mount packages are used instead because their tiny terminations keep lead inductance and stray coupling to a minimum.
Watch out Dielectric loss in the epoxy body is a real but minor effect compared with lead inductance, and the epoxy does not become conductive at any amateur frequency; that choice is simply invented.
At UHF, wire is inductor and antenna: short leads win. DIP legs are too long, so go surface mount.
HamSandwich explanation, first draft. The question and answers are the NCVEC text.
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The rest of E6E

  1. E6E01 Why is gallium arsenide (GaAs) useful for semiconductor devices operating at UHF and higher frequencies?
  2. E6E02 Which of the following device packages is a through-hole type?
  3. E6E03 Which of the following materials supports the highest frequency of operation when used in MMICs?
  4. E6E04 Which is the most common input and output impedance of MMICs?
  5. E6E05 Which of the following noise figure values is typical of a low-noise UHF preamplifier?
  6. E6E06 What characteristics of MMICs make them a popular choice for VHF through microwave circuits?
  7. E6E07 What type of transmission line is often used for connections to MMICs?
  8. E6E08 How is power supplied to the most common type of MMIC?
  9. E6E09 Which of the following component package types have the least parasitic effects at frequencies above the HF r…
  10. E6E10 What advantage does surface-mount technology offer at RF compared to using through-hole components?
  11. E6E11 What is a characteristic of DIP packaging used for integrated circuits?
  12. E6E12 Why are DIP through-hole package ICs not typically used at UHF and higher frequencies?
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