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E6E08

CIRCUIT COMPONENTS · Semiconductor materials and packages for RF use

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How is power supplied to the most common type of MMIC?

  1. AThrough a capacitor and RF choke connected to the amplifier input lead
  2. BMMICs require no operating bias
  3. CThrough a resistor and/or RF choke connected to the amplifier output lead
  4. DDirectly to the bias voltage (Vcc) lead
Why The common MAR/ERA style MMIC amplifier has only four leads: RF in, RF out, and two grounds. There is no separate Vcc pin, so DC bias is fed into the device through the output lead, using a series dropping resistor and/or an RF choke to set the current while keeping the RF signal from being shorted to the supply. A DC blocking capacitor after that feed point passes the amplified RF to the next stage.
Watch out Expecting a dedicated Vcc lead is the natural assumption from other ICs, but this MMIC package simply does not have one; feeding bias into the input lead would also disturb the input matching and the driving stage.
MMIC = no Vcc pin. Bias rides in on the output lead through a resistor/choke.
HamSandwich explanation, first draft. The question and answers are the NCVEC text.
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The rest of E6E

  1. E6E01 Why is gallium arsenide (GaAs) useful for semiconductor devices operating at UHF and higher frequencies?
  2. E6E02 Which of the following device packages is a through-hole type?
  3. E6E03 Which of the following materials supports the highest frequency of operation when used in MMICs?
  4. E6E04 Which is the most common input and output impedance of MMICs?
  5. E6E05 Which of the following noise figure values is typical of a low-noise UHF preamplifier?
  6. E6E06 What characteristics of MMICs make them a popular choice for VHF through microwave circuits?
  7. E6E07 What type of transmission line is often used for connections to MMICs?
  8. E6E08 How is power supplied to the most common type of MMIC?
  9. E6E09 Which of the following component package types have the least parasitic effects at frequencies above the HF r…
  10. E6E10 What advantage does surface-mount technology offer at RF compared to using through-hole components?
  11. E6E11 What is a characteristic of DIP packaging used for integrated circuits?
  12. E6E12 Why are DIP through-hole package ICs not typically used at UHF and higher frequencies?
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