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E6E09

CIRCUIT COMPONENTS · Semiconductor materials and packages for RF use

E6E09E6E →

Which of the following component package types have the least parasitic effects at frequencies above the HF range?

  1. ATO-220
  2. BAxial lead
  3. CRadial lead
  4. DSurface mount
Why Every wire lead on a component acts as a small inductor (roughly 20 nH per inch) and adds stray capacitance, and those parasitics matter more as frequency rises because inductive reactance grows with f. Surface mount devices have essentially no leads: the body solders directly to the pads, so lead inductance and stray capacitance are minimized. That is why VHF, UHF and microwave circuits are built almost entirely from SMT parts.
Watch out Axial and radial lead parts, and the TO-220 power package with its long pins and metal tab, all have wire leads and bulky bodies that add inductance and capacitance right where you least want it above HF.
No leads, no parasitics. Above HF, go surface mount.
HamSandwich explanation, first draft. The question and answers are the NCVEC text.
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The rest of E6E

  1. E6E01 Why is gallium arsenide (GaAs) useful for semiconductor devices operating at UHF and higher frequencies?
  2. E6E02 Which of the following device packages is a through-hole type?
  3. E6E03 Which of the following materials supports the highest frequency of operation when used in MMICs?
  4. E6E04 Which is the most common input and output impedance of MMICs?
  5. E6E05 Which of the following noise figure values is typical of a low-noise UHF preamplifier?
  6. E6E06 What characteristics of MMICs make them a popular choice for VHF through microwave circuits?
  7. E6E07 What type of transmission line is often used for connections to MMICs?
  8. E6E08 How is power supplied to the most common type of MMIC?
  9. E6E09 Which of the following component package types have the least parasitic effects at frequencies above the HF r…
  10. E6E10 What advantage does surface-mount technology offer at RF compared to using through-hole components?
  11. E6E11 What is a characteristic of DIP packaging used for integrated circuits?
  12. E6E12 Why are DIP through-hole package ICs not typically used at UHF and higher frequencies?
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