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E6E04

CIRCUIT COMPONENTS · Semiconductor materials and packages for RF use

E6E04E6E →

Which is the most common input and output impedance of MMICs?

  1. A50 ohms
  2. B300 ohms
  3. C450 ohms
  4. D75 ohms
Why MMICs (monolithic microwave integrated circuits) are built as drop-in gain blocks for standard RF systems, so their internal matching networks are designed around the universal RF test and system impedance of 50 ohms. That lets you solder one into a 50 ohm microstrip line with just a bias resistor and choke, no matching network needed. Nearly all RF test gear, connectors and coax used in amateur and commercial microwave work is 50 ohms as well.
Watch out The 75 ohm choice is the video and CATV coax standard, and 300 ohms is old TV twin-lead ribbon; neither is used for MMIC gain blocks.
RF gear speaks 50 ohms. MMICs plug straight into 50 ohm microstrip with no matching network.
HamSandwich explanation, first draft. The question and answers are the NCVEC text.
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The rest of E6E

  1. E6E01 Why is gallium arsenide (GaAs) useful for semiconductor devices operating at UHF and higher frequencies?
  2. E6E02 Which of the following device packages is a through-hole type?
  3. E6E03 Which of the following materials supports the highest frequency of operation when used in MMICs?
  4. E6E04 Which is the most common input and output impedance of MMICs?
  5. E6E05 Which of the following noise figure values is typical of a low-noise UHF preamplifier?
  6. E6E06 What characteristics of MMICs make them a popular choice for VHF through microwave circuits?
  7. E6E07 What type of transmission line is often used for connections to MMICs?
  8. E6E08 How is power supplied to the most common type of MMIC?
  9. E6E09 Which of the following component package types have the least parasitic effects at frequencies above the HF r…
  10. E6E10 What advantage does surface-mount technology offer at RF compared to using through-hole components?
  11. E6E11 What is a characteristic of DIP packaging used for integrated circuits?
  12. E6E12 Why are DIP through-hole package ICs not typically used at UHF and higher frequencies?
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